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Ed Briggs’s Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes has made the top 10 list of SMT Tech Tuesday articles for 2014 by SMTOnline, one of the PCBA industry's most respected publications. This is the third consecutive year that an Indium Corporation authored paper has been named to this list, January 2015.
Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.. The Indium8.9HF series is an air reflow, no-clean solder paste suite specially formulated to accommodate the higher processing temperatures required by the SnAgCu (SAC), SnAg, and other alloy systems favored by the automotive electronics industry.
Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void ® —at Productronica China 2018, March 14-16, 2018, in Shanghai. Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.